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Wafer fabrication
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161	FRAUNHOFER-INSTITUT FÜR ZUVERLÄSSIGKEIT UND MIKROINTEGRATION J OIN THE T EAM ! Job opportunities @ Fraunhofer IZM-ASSID in Dresden/Moritzburg WHO WE ARE: Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 14:28:22 Materials science Fraunhofer Society Wafer bonding Through-silicon via Wafer Deep reactive-ion etching Semiconductor device fabrication Microtechnology Electronics
162	NANOELECTRONICS FABRICATION FACILITY (NFF), HKUST Standard Operating Manual ___________________________________________________________ Branson IPC 3000 O2 Asher Add to Reading List Source URL: mfz140.ust.hk Language: English - Date: 2014-07-23 02:45:18 Electromagnetism Etching Pressure measurement Nanoelectronics Quartz Wafer Semiconductor device fabrication Technology Materials science
163	MAKING A MOLD USING SU-8 PHOTORESIST All work is done with Saurabh Vyawahare in the Princeton Microfluidics Core facility in 105 Jadwin Hall (Physics Department). Website: http://www.princeton.edu/microfluidics/ Material Add to Reading List Source URL: www.princeton.edu Language: English - Date: 2013-03-28 20:26:26 Chemistry Spin coating Photoresist Wafer Ultraviolet Resist Photolithography Semiconductor device fabrication Materials science Technology
164	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
165	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
166	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM 3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-11 11:27:45 Materials science Wafer Three-dimensional integrated circuit Microelectromechanical systems Through-silicon via Flip chip Fraunhofer Society Die preparation Semiconductor device fabrication Microtechnology Electronics
167	Sliding Window Locks & Latches Please press Ctrl + F to search for product codes Sliding Window Latches DS332 Sliding Window Latch Material: PolesiumTM. Add to Reading List Source URL: doric.com.au Language: English - Date: 2013-02-04 00:22:13 Semiconductor device fabrication Architecture Locks Latch Flip-flop Cylinder Wafer Key Electronics Locksmithing Door furniture Construction
168	At The Edge EM EXPLORER Simulation of Wafer Topography Effects in Double Patterning Lithography Add to Reading List Source URL: emexplorer.net Language: English - Date: 2009-02-15 16:35:45 Science Multiple patterning Resist Wafer Finite-difference time-domain method Photolithography Chemical-mechanical planarization Semiconductor device fabrication Physics Technology
169	Microsoft PowerPoint - for nsf high school students.ppt Add to Reading List Source URL: cba.mit.edu Language: English - Date: 2011-12-13 18:50:30 Chemistry Technology Etching Tetramethylammonium hydroxide Carbon nanotube Wafer Thermal oxidation Photoresist Microelectromechanical systems Materials science Semiconductor device fabrication Microtechnology
170	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-02 11:52:26 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology

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